Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
- Patent Title (中): 印刷电路板
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Application No.: US12647395Application Date: 2009-12-25
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Publication No.: US20110094782A1Publication Date: 2011-04-28
- Inventor: HUA-LI ZHOU , CHIA-NAN PAI , SHOU-KUO HSU
- Applicant: HUA-LI ZHOU , CHIA-NAN PAI , SHOU-KUO HSU
- Applicant Address: TW Shenzhen City TW Tu-Cheng
- Assignee: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Shenzhen City TW Tu-Cheng
- Priority: CN200910308935.5 20091028
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ≈ 8 Wpad + 10 T 0.8 Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.
Public/Granted literature
- US08194412B2 Printed circuit board Public/Granted day:2012-06-05
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