发明申请
- 专利标题： INTEGRATED CHIP CARRIER WITH COMPLIANT INTERCONNECTS
- 专利标题（中）： 集成芯片载体与合规互连
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申请号： US12986460申请日： 2011-01-07
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公开(公告)号： US20110101540A1公开(公告)日： 2011-05-05
- 发明人: Timothy J. Chainer
- 申请人： Timothy J. Chainer
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/50
- IPC分类号： H01L23/50
摘要：
A silicon chip includes a silicon substrate, a plurality of pads, and a plurality of through vias to connect back-end-of-line wiring to the plurality of pads. The silicon substrate includes a layer of active devices and the back-end-of-line wiring connected to the active devices.
公开/授权文献
- US08344516B2 Integrated chip carrier with compliant interconnects 公开/授权日：2013-01-01
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