The invention provides a molded foam molding method capable of obtaining a molded foam in which pinholes may not be formed with ease even when a blow ratio is high and which has a high expansion ratio. The invention also provides a molded foam which includes no pinholes, is reduced in weight, and is excellent in heat insulating property. The molding method includes blending a polypropylene-based resin having an equilibrium compliance from 2.0 to 6.0 (10−3×Pa−1) with a foaming agent and kneading the blend in an extruder. The extruded foamed resin is molded so as to be fit along a mold by a pressurized fluid. Moreover, the molded foam is formed by the method described above, and has an expansion ratio from 1.5 to 5.0 times and an impact strength of not less than 30 kg·cm.