发明申请
US20110104874A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer
有权
能量射线可固化聚合物，能量线可固化粘合剂组合物，粘合片和半导体晶片的加工方法
- 专利标题： Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer
- 专利标题（中）： 能量射线可固化聚合物，能量线可固化粘合剂组合物，粘合片和半导体晶片的加工方法
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申请号： US12935677申请日： 2009-03-12
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公开(公告)号： US20110104874A1公开(公告)日： 2011-05-05
- 发明人: Jun Maeda , Keiko Tanaka
- 申请人： Jun Maeda , Keiko Tanaka
- 申请人地址： JP Tokyo
- 专利权人： LINTEC CORPORATION
- 当前专利权人： LINTEC CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-0938972008 20080331
- 国际申请： PCT/JP2009/054742 WO 20090312
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; C08F216/10
摘要：
In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.
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