An edge card connector includes: a substantially rigid, insulating housing having internal electrical contacts to engage the edge of a first circuit board inserted into the housing; solder balls arranged on an outer surface of the housing in a selected pattern to establish connections to corresponding conductive pads on a second circuit board when the solder balls are at least partially melted; and, electrical connections between the internal electrical contacts and the solder balls. The socket may contain additional features for added strength, ease of assembly, and other purposes. The system is assembled by placing the socket onto a circuit board, aligning the solder balls with respective contact pads, and fusing the solder balls to establish electrical connectivity. A standoff structure may be provided to avoid excessive compaction of the solder balls.