发明申请
- 专利标题： SYSTEM AND METHOD FOR CHECKING GROUND VIAS OF A CONTROLLER CHIP OF A PRINTED CIRCUIT BOARD
- 专利标题（中）： 印刷电路板控制芯片的接地检查系统及方法
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申请号： US12700747申请日： 2010-02-05
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公开(公告)号： US20110106481A1公开(公告)日： 2011-05-05
- 发明人: HSIEN-CHUAN LIANG , SHEN-CHUN LI , CHUN-JEN CHEN , SHOU-KUO HSU , YUNG-CHIEH CHEN , WEN-LAING TSENG
- 申请人： HSIEN-CHUAN LIANG , SHEN-CHUN LI , CHUN-JEN CHEN , SHOU-KUO HSU , YUNG-CHIEH CHEN , WEN-LAING TSENG
- 申请人地址： TW Tu-Cheng
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： TW Tu-Cheng
- 优先权： CN200910309064.9 20091029
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; G01R31/00
摘要：
A system and method for checking a ground via of control chips of a printed circuit board (PCB) provides a graphical user interface (GUI) displaying a layout of the PCB. The control chip has a plurality of ground pins. The computer searches for signal path routing of each ground pin and ground vias along each signal path routing of each ground pin. If there are any ground vias having the same absolute coordinates, the computer determines that the ground vias are shared by more than one ground pin.