发明申请
- 专利标题: WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT
- 专利标题(中): 湿蚀刻绝缘子和电子电路组件
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申请号: US13006135申请日: 2011-01-13
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公开(公告)号: US20110108519A1公开(公告)日: 2011-05-12
- 发明人: Katsuya SAKAYORI , Terutoshi Momose , Shigeki Kawano , Tomoko Togashi , Hiroko Amasaki , Nobuhiro Sakihama , Tsuyoshi Yamazaki , Michiaki Uchiyama , Hiroshi Yagi
- 申请人: Katsuya SAKAYORI , Terutoshi Momose , Shigeki Kawano , Tomoko Togashi , Hiroko Amasaki , Nobuhiro Sakihama , Tsuyoshi Yamazaki , Michiaki Uchiyama , Hiroshi Yagi
- 申请人地址: JP Tokyo-To
- 专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人地址: JP Tokyo-To
- 优先权: JP2001-40891 20010216; JP2001-40892 20010216; JP2001-40893 20010216; JP2001-97436 20010329; JP2001-258815 20010828
- 主分类号: H05K3/00
- IPC分类号: H05K3/00
摘要:
The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
公开/授权文献
- US08308967B2 Wet etched insulator and electronic circuit component 公开/授权日:2012-11-13
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