发明申请
US20110108937A1 Magnetic Tunnel Junction Structure 有权
磁隧道结结构

  • 专利标题: Magnetic Tunnel Junction Structure
  • 专利标题(中): 磁隧道结结构
  • 申请号: US12944663
    申请日: 2010-11-11
  • 公开(公告)号: US20110108937A1
    公开(公告)日: 2011-05-12
  • 发明人: Jason Reid
  • 申请人: Jason Reid
  • 申请人地址: FR Grenoble
  • 专利权人: CROCUS TECHNOLOGY SA
  • 当前专利权人: CROCUS TECHNOLOGY SA
  • 当前专利权人地址: FR Grenoble
  • 主分类号: H01L29/82
  • IPC分类号: H01L29/82
Magnetic Tunnel Junction Structure
摘要:
Disclosed herein is a thermally-assisted magnetic tunnel junction structure including a thermal barrier. The thermal barrier is composed of a cermet material in a disordered form such that the thermal barrier has a low thermal conductivity and a high electric conductivity. Compared to conventional magnetic tunnel junction structures, the disclosed structure can be switched faster and has improved compatibility with standard semiconductor fabrication processes.
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