A knife assembly includes a knife blade and a mounting assembly having a knife blade support portion extending along a longitudinal axis of the mounting assembly. The knife blade support portion is constructed and arranged to position a cutting edge of the knife blade distal to a leading edge of the mounting assembly. The mounting assembly also has a counter knife portion disposed at the leading edge of the mounting assembly that defines a set back distance with the knife blade. The set back distance is constructed and arranged to provide a travel path for a wafer.