Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
- Patent Title (中): 印刷电路板
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Application No.: US12633653Application Date: 2009-12-08
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Publication No.: US20110114379A1Publication Date: 2011-05-19
- Inventor: YUNG-CHIEH CHEN , CHENG-HSIEN LEE , SHOU-KUO HSU , SHEN-CHUN LI , HSIEN-CHUAN LIANG , SHIN-TING YEN
- Applicant: YUNG-CHIEH CHEN , CHENG-HSIEN LEE , SHOU-KUO HSU , SHEN-CHUN LI , HSIEN-CHUAN LIANG , SHIN-TING YEN
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: CN200910309671.5 20091113
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.
Public/Granted literature
- US08253031B2 Printed circuit board Public/Granted day:2012-08-28
Information query
