A method for flip-chip interconnection includes applying a dielectric film onto the active side of the die, or onto the die mount side of the substrate, or both onto the die and onto the substrate; then orienting and aligning the die in relation to the substrate, and moving the die toward the substrate so that interconnect contact is made; then treating the assembly (for example by heating or by heating and pressing) to complete the electrical connections and to cause the film to soften and to adhere. Also, a method for flip-chip assembly includes completing electrical connection of the flip-chip interconnects on a die with bond pads on a substrate and thereafter exposing the assembly to a CVD process to fill the headspace between the die and the substrate with a dielectric material. Also, a flip-chip assembly is made by the method. Also, a die or a substrate is prepared for flip-chip interconnection by applying a dielectric film on a surface thereof.