The present invention relates to a manufacturing process for the ceramics substrate, more particularly attaching a dry membrane to a surface of the metallic layer of the ceramics substrate, and removing the dry membrane from the circuit portion after exposure and development process to expose the metallic layer therein. Furthermore, the conductive metallic layer coated onto the surface of the metallic layer of the circuit, and the etching resistance layer is coated onto the surface of the conductive metallic layer, and further the dry membrane is removed and the conductive metallic layer and the metallic layer are etched. The etchant is blocked by the etching resistance layer to prevent etchant from directly contacting the surface of the conductive metallic layer. Thus, the predetermined width of the circuit will not be reduced and the precision of the circuit size can be upgraded.