发明申请
- 专利标题： ELECTRONIC CIRCUIT AND IC TAG
- 专利标题（中）： 电子电路和IC标签
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申请号： US13003266申请日： 2009-06-29
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公开(公告)号： US20110121085A1公开(公告)日： 2011-05-26
- 发明人: Taiga Matsushita , Katsumi Katakura
- 申请人： Taiga Matsushita , Katsumi Katakura
- 申请人地址： JP Itabashi-ku, Tokyo
- 专利权人： LINTEC CORPORATION
- 当前专利权人： LINTEC CORPORATION
- 当前专利权人地址： JP Itabashi-ku, Tokyo
- 优先权： JP2008-179316 20080709
- 国际申请： PCT/JP2009/062242 WO 20090629
- 主分类号： G06K19/077
- IPC分类号： G06K19/077 ; H05K1/00
摘要：
The present invention provides an electronic circuit which comprises a circuit line and a terminal portion connected to the circuit line, wherein the terminal portion has a folding endurance structure at a junction where the terminal portion is connected to the circuit line and the folding endurance structure of the terminal portion has a plane width gradually-increasing portion, in which the width of the terminal portion in plane view increases continuously or intermittently as the folding endurance structure of the terminal portion becomes away from the junction where the terminal portion is connected to the circuit line. The electronic circuit and an IC tag incorporating the electronic circuit of the present invention are excellent in folding endurance property, and can have an electronic circuit which is hard to break even if the electronic circuit is folded.
公开/授权文献
- US08292188B2 Electronic circuit and IC tag 公开/授权日：2012-10-23