发明申请
- 专利标题： CONDUCTIVE CONTACT LAYER FORMED ON A TRANSPARENT CONDUCTIVE LAYER BY A REACTIVE SPUTTER DEPOSITION
- 专利标题（中）： 通过反应溅射沉积形成透明导电层的导电接触层
-
申请号： US12628569申请日： 2009-12-01
-
公开(公告)号： US20110126875A1公开(公告)日： 2011-06-02
- 发明人: Hien-Minh Huu Le , Valery V. Komin , David Tanner , Mohd Fadzli Anwar Hassan , Tzay-Fa Su , Dapeng Wang
- 申请人： Hien-Minh Huu Le , Valery V. Komin , David Tanner , Mohd Fadzli Anwar Hassan , Tzay-Fa Su , Dapeng Wang
- 主分类号： H01L31/042
- IPC分类号： H01L31/042 ; C23C14/34 ; H01L31/06
摘要：
Methods for sputter depositing a transparent conductive layer and a conductive contact layer are provided in the present invention. In one embodiment, the method includes forming a transparent conductive layer on a substrate by materials sputtered from a first target disposed in a reactive sputter chamber, and forming a conductive contact layer on the transparent conductive layer by materials sputtered from a second target disposed in the reactive sputter chamber.
信息查询
IPC分类:
