发明申请
- 专利标题： LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 发光二极管封装及其制造方法
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申请号： US12944401申请日： 2010-11-11
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公开(公告)号： US20110127558A1公开(公告)日： 2011-06-02
- 发明人: Young Sam PARK , Hun Joo Hahm
- 申请人： Young Sam PARK , Hun Joo Hahm
- 优先权： KR10-2009-0115559 20091127
- 主分类号： H01L33/58
- IPC分类号： H01L33/58 ; H01L33/48
摘要：
There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.
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