发明申请
US20110131802A1 Thermal Mass Compensated Dielectric Foam Support Structures for Coaxial Cables and Method of Manufacture
审中-公开
用于同轴电缆的热质量补偿电介质泡沫支撑结构及其制造方法
- 专利标题： Thermal Mass Compensated Dielectric Foam Support Structures for Coaxial Cables and Method of Manufacture
- 专利标题（中）： 用于同轴电缆的热质量补偿电介质泡沫支撑结构及其制造方法
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申请号： US13018851申请日： 2011-02-01
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公开(公告)号： US20110131802A1公开(公告)日： 2011-06-09
- 发明人: Mark Witthoft , Alan Moe
- 申请人： Mark Witthoft , Alan Moe
- 申请人地址： US NC Hickory
- 专利权人： ANDREW LLC
- 当前专利权人： ANDREW LLC
- 当前专利权人地址： US NC Hickory
- 主分类号： H01B13/20
- IPC分类号： H01B13/20
摘要：
A method for manufacturing a coaxial cable wherein an inner conductor is coated with an adhesive solid or high-density foam polymer or blend. The adhesive solid or high density foam polymer or blend surrounding the inner conductor is provided with a thickness at least 30 percent of the inner conductor diameter. The adhesive solid or high-density foam polymer or blend is surrounded with a foam dielectric. The foam dielectric is surrounded with an outer conductor.
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