发明申请
- 专利标题： LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME
- 专利标题（中）： 用于无铅包装的结构和制造方法
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申请号： US13016453申请日： 2011-01-28
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公开(公告)号： US20110136299A1公开(公告)日： 2011-06-09
- 发明人: Chun Ying Lin , Geng Shin Shen , Yu Tang Pan , Shih Wen Chou
- 申请人： Chun Ying Lin , Geng Shin Shen , Yu Tang Pan , Shih Wen Chou
- 申请人地址： TW Hsinchu
- 专利权人： CHIPMOS TECHNOLOGIES INC.
- 当前专利权人： CHIPMOS TECHNOLOGIES INC.
- 当前专利权人地址： TW Hsinchu
- 优先权： TW096113893 20070420
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
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