发明申请
- 专利标题： POLISHING HEAD AND POLISHING APPARATUS
- 专利标题（中）： 抛光头和抛光装置
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申请号： US13056249申请日： 2009-08-07
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公开(公告)号： US20110136414A1公开(公告)日： 2011-06-09
- 发明人: Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
- 申请人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
- 申请人地址： JP TOKYO JP NAGANO-SHI, NAGANO
- 专利权人： SHIN-ETSU HANDOTAI CO., LTD.,FUJIKOSHI MACHINERY CORP.
- 当前专利权人： SHIN-ETSU HANDOTAI CO., LTD.,FUJIKOSHI MACHINERY CORP.
- 当前专利权人地址： JP TOKYO JP NAGANO-SHI, NAGANO
- 优先权： JP2008-222039 20080829
- 国际申请： PCT/JP2009/003796 WO 20090807
- 主分类号： B24B37/04
- IPC分类号： B24B37/04 ; H01L21/304 ; B24B37/00
摘要：
A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
公开/授权文献
- US08636561B2 Polishing head and polishing apparatus 公开/授权日：2014-01-28
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