发明申请
- 专利标题: PRINTED CIRCUIT BOARD
- 专利标题(中): 印刷电路板
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申请号: US12772469申请日: 2010-05-03
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公开(公告)号: US20110139489A1公开(公告)日: 2011-06-16
- 发明人: Hee-Soo Yoon , Dong-Hwan Lee , Kyoung-Ho Lee , Yoon-Dong Kim , Su-Bong Jang
- 申请人: Hee-Soo Yoon , Dong-Hwan Lee , Kyoung-Ho Lee , Yoon-Dong Kim , Su-Bong Jang
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2009-0122512 20091210
- 主分类号: H05K1/00
- IPC分类号: H05K1/00
摘要:
A printed circuit board is disclosed. The printed circuit board in accordance with an embodiment of the present invention can include an insulation substrate, a first ground, which is formed on one surface of the insulation substrate and connected to a first power source, a second ground, which is formed on one surface of the insulation substrate and connected to a second power source, a separator, which separates the first ground from the second ground, a first signal line, which is stacked on at least one of the first ground and the second ground, and a second signal line, which is stacked on at least one of the first ground and the second ground and is adjacent to the first signal line. The separator can include a curved part, which is bent in between the first signal line and the second signal line.
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