发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有堆叠互连的集成电路包装系统及其制造方法
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申请号： US12639984申请日： 2009-12-16
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公开(公告)号： US20110140259A1公开(公告)日： 2011-06-16
- 发明人: NamJu Cho , HeeJo Chi , HanGil Shin , Rui Huang , Seng Guan Chow , Heap Hoe Kuan
- 申请人： NamJu Cho , HeeJo Chi , HanGil Shin , Rui Huang , Seng Guan Chow , Heap Hoe Kuan
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/98 ; H01L25/065
摘要：
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate; coupling a conductive column lead frame to the base package substrate by: providing a lead frame support, patterning a conductive material on the lead frame support including forming an interconnect securing structure, and coupling the conductive material to the base package substrate; forming a base package body between the base package substrate and the conductive column lead frame; and removing the lead frame support from the conductive column lead frame for exposing the interconnect securing structure from the base package body.