发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND WIRE PADS AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 带有线束的集成电路包装系统及其制造方法
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申请号： US12637746申请日： 2009-12-14
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公开(公告)号： US20110140287A1公开(公告)日： 2011-06-16
- 发明人: Henry Descalzo Bathan , Jairus Legaspi Pisigan , Zigmund Ramirez Camacho
- 申请人： Henry Descalzo Bathan , Jairus Legaspi Pisigan , Zigmund Ramirez Camacho
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L21/60
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wire pads that horizontally overlap; and forming an interconnection between the device and the bond wire pad row.
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