发明申请
- 专利标题： ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME
- 专利标题（中）： 电极结构，接线体，粘合连接结构，电子器件及其制造方法
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申请号： US13060845申请日： 2010-04-13
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公开(公告)号： US20110147048A1公开(公告)日： 2011-06-23
- 发明人: Masamichi Yamamoto , Kyouichirou Nakatsugi , Takashi Yamaguchi , Shigeki Kawakami , Michihiro Kimura
- 申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Takashi Yamaguchi , Shigeki Kawakami , Michihiro Kimura
- 优先权： JP2009-125462 20090525
- 国际申请： PCT/JP2010/056554 WO 20100413
- 主分类号： H01B5/00
- IPC分类号： H01B5/00 ; H01R43/02
摘要：
There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.