A semiconductor element according to an embodiment of present application includes a first voltage drop portion providing a first voltage drop, a second voltage drop portion providing a second voltage drop, and a connecting material between the first voltage drop portion and the second voltage drop portion and having a physical dimension smaller than that of at least one of the first voltage drop portion and the second voltage drop portion. The semiconductor element can operate under a total bias voltage. The total bias voltage is greater than the second voltage drop, while the second voltage drop is greater than or equal to the first voltage drop.