发明申请
- 专利标题: TOP BOND PAD FOR TRANSDUCING HEAD INTERCONNECT
- 专利标题(中): 用于传输头部互连的顶部粘结垫
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申请号: US13046242申请日: 2011-03-11
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公开(公告)号: US20110157750A1公开(公告)日: 2011-06-30
- 发明人: Jianxin Zhu , David A. Sluzewski , Lance E. Stover , Joel W. Hoehn , Kevin J. Schulz
- 申请人: Jianxin Zhu , David A. Sluzewski , Lance E. Stover , Joel W. Hoehn , Kevin J. Schulz
- 申请人地址: US CA Scotts Valley
- 专利权人: SEAGATE TECHNOLOGY LLC
- 当前专利权人: SEAGATE TECHNOLOGY LLC
- 当前专利权人地址: US CA Scotts Valley
- 主分类号: G11B5/48
- IPC分类号: G11B5/48
摘要:
A slider includes a slider body having a first side and edges defined adjacent to the first side, at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body, and a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body. The at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.
公开/授权文献
- US08351158B2 Top bond pad for transducing head interconnect 公开/授权日:2013-01-08
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