发明申请
- 专利标题: SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS
- 专利标题(中): 具有嵌入式电路板的系统级封装
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申请号: US12974673申请日: 2010-12-21
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公开(公告)号: US20110157858A1公开(公告)日: 2011-06-30
- 发明人: Ji-Hyun Jung , Byung-Jik Kim , Shi-Yun Cho , Ho-Seong Seo , Kyung-Wan Park , Yeun-Ho Choi , Yu-Su Kim , Seok-Myong Kang
- 申请人: Ji-Hyun Jung , Byung-Jik Kim , Shi-Yun Cho , Ho-Seong Seo , Kyung-Wan Park , Yeun-Ho Choi , Yu-Su Kim , Seok-Myong Kang
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2009-0131017 20091224
- 主分类号: H05K1/14
- IPC分类号: H05K1/14
摘要:
Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.