发明申请
- 专利标题： IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 图像传感器模块及其制造方法
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申请号： US13042684申请日： 2011-03-08
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公开(公告)号： US20110159630A1公开(公告)日： 2011-06-30
- 发明人: Sung Min KIM
- 申请人： Sung Min KIM
- 申请人地址： KR Gyeonggi-do
- 专利权人： HYNIX SEMICONDUCTOR INC.
- 当前专利权人： HYNIX SEMICONDUCTOR INC.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2008-0098755 20081008
- 主分类号： H01L31/18
- IPC分类号： H01L31/18
摘要：
An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.
公开/授权文献
- US08232131B2 Image sensor module and method of manufacturing the same 公开/授权日：2012-07-31