A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.