发明申请
- 专利标题: ELECTRONIC DEVICE AND EMI/ESD PROTECTION MODULE THEREOF
- 专利标题(中): 电子器件及其EMI / ESD保护模块
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申请号: US12699880申请日: 2010-02-04
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公开(公告)号: US20110162878A1公开(公告)日: 2011-07-07
- 发明人: Chung-Won Shu , Chih-Heng Chiu , Din-Ji Tzou , Chung-Wen Huang
- 申请人: Chung-Won Shu , Chih-Heng Chiu , Din-Ji Tzou , Chung-Wen Huang
- 优先权: TW099100263 20100107
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
An EMI/ESD protection module is disposed between a first metal connecting member and a second metal connecting member. The EMI/ESD protection module includes a first conductive member, a second conductive member and a resilient member. The first conductive member is electrically connected to the first metal connecting member. The second conductive member is movably connected to the first conductive member and electrically connected to the second metal connecting member. The resilient member is disposed between the first and second conductive members.
公开/授权文献
- US08158893B2 Electronic device and EMI/ESD protection module thereof 公开/授权日:2012-04-17