发明申请
- 专利标题： POWDER MIXTURE TO BE MADE INTO EVAPORATION SOURCE MATERIAL FOR USE IN ION PLATING, EVAPORATION SOURCE MATERIAL FOR USE IN ION PLATING AND METHOD OF PRODUCING THE SAME, AND GAS BARRIER SHEET AND METHOD OF PRODUCING THE SAME
- 专利标题（中）： 将粉末混合物用于离子喷涂中使用的蒸发源材料，用于离子镀层的蒸发源材料及其制造方法和气体阻挡片及其制造方法
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申请号： US13044704申请日： 2011-03-10
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公开(公告)号： US20110163276A1公开(公告)日： 2011-07-07
- 发明人: Yoshihiro KISHIMOTO
- 申请人： Yoshihiro KISHIMOTO
- 申请人地址： JP Shinjuku-Ku
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Shinjuku-Ku
- 优先权： JP2007-162497 20070620
- 主分类号： C23C14/14
- IPC分类号： C23C14/14 ; H01B1/04
摘要：
A powder mixture to be made into an evaporation source material for use in ion plating, and an evaporation source material useful for ion plating and a method of producing it, and a gas barrier sheet and a method of producing it. The powder mixture comprises 100 parts by weight of silicon oxide powder and 5 to 100 parts by weight of a conductive material powder. Preferably, both the silicon oxide powder and the conductive material powder have a mean particle diameter of 5 μm or less. The conductive material powder is preferably a powder of at least one material selected from metals and electrically conductive metallic oxides, nitrides and acid nitrides. The evaporation source material for use in ion plating is in the form of agglomerates having a mean particle diameter of 2 mm or more, or a block, obtained by granulating or compression-molding the powder mixture.
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