Provided is a fine structure which allows the formation of a highly accurate metallic replica mold. The structure is resistant to breakage even in the presence of foreign particles or bumps and causes a smaller transfer failure region even when applied to an undulating object to be transferred. Also provided is a stamper for imprinting, which conforms to local bumps of a substrate to be transferred, causes, if any, a smaller pattern transfer failure region, and has satisfactory durability.The fine structure includes a supporting member; and a pattern layer having a fine asperity pattern formed on a surface thereof. The pattern layer is made from a resin through curing of a resin composition containing a cationic-polymerization catalyst and two or more organic components having different functional groups, and the supporting member and the pattern layer each transmit light having a wavelength of 365 nm or longer. The stamper for imprinting includes a base layer; a buffer layer; and a pattern layer having a fine asperity geometry formed on a surface thereof. The stamper is adopted to transferring of the asperity geometry to a surface of an object to be transferred by contacting the pattern layer with the object to be transferred. The buffer layer is arranged on another surface of the pattern layer opposite to the surface on which the asperity geometry is formed, and the base layer is arranged on another surface of the buffer layer opposite to the surface on which the pattern layer is arranged. The buffer layer has a Young's modulus lower than the Young's modulus of the pattern layer, and the base layer has a Young's modulus higher than the Young's modulus of the buffer layer.