发明申请
- 专利标题： Circuit Board For LED
- 专利标题（中）： LED电路板
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申请号： US13074125申请日： 2011-03-29
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公开(公告)号： US20110175135A1公开(公告)日： 2011-07-21
- 发明人: Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
- 申请人： Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
- 申请人地址： TW New Taipei City CN Shanghai
- 专利权人： EVERLIGHT ELECTRONICS CO., LTD,EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD
- 当前专利权人： EVERLIGHT ELECTRONICS CO., LTD,EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD
- 当前专利权人地址： TW New Taipei City CN Shanghai
- 优先权： TW097144357 20081117
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H05K1/11
摘要：
A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion.
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