发明申请
- 专利标题： SEMICONDUCTOR DEVICE, FLIP-CHIP MOUNTING METHOD AND FLIP-CHIP MOUNTING APPARATUS
- 专利标题（中）： 半导体器件，片式安装方法和片式安装设备
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申请号： US13056462申请日： 2009-11-06
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公开(公告)号： US20110175237A1公开(公告)日： 2011-07-21
- 发明人: Yoshihiro Tomura , Kazumichi Shimizu , Kentaro Kumazawa
- 申请人： Yoshihiro Tomura , Kazumichi Shimizu , Kentaro Kumazawa
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2008-319040 20081216; JP2008-331662 20081226
- 国际申请： PCT/JP2009/005890 WO 20091106
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50 ; B29C65/20
摘要：
A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.
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