发明申请
- 专利标题: HIGH POWER, LOW-PASSIVE INTERMODULATION MICROWAVE TERMINATION
- 专利标题(中): 高功率,低被动互调微波终端
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申请号: US12688311申请日: 2010-01-15
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公开(公告)号: US20110175690A1公开(公告)日: 2011-07-21
- 发明人: Marek E. Antkowiak , Carl Schraufnagl
- 申请人: Marek E. Antkowiak , Carl Schraufnagl
- 主分类号: H01P1/26
- IPC分类号: H01P1/26
摘要:
A termination configured to absorb high microwave power while generating low levels of passive intermodulation interference. The termination includes a microwave cable having a first end and a second end providing an insertion loss from the first end to the second end, a heat-dispersive element in thermal contact with at least a portion of the microwave cable, a channel accommodating the microwave cable, and an input connector coupled to the proximal end of the microwave cable. Optionally, one or more plates having grooves to accommodate the microwave cable may be provided between the heat-dispersive elements.
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