A filler panel for an electronics shelf is provided. The electronics shelf includes a number of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a side wall, and a back wall. The front wall and back wall are configured to fill a width of a slot of the electronics shelf and the side wall is configured to extend into a depth of the slot. The filler panel also includes an electromagnetic shielding portion made of a conductive material and coupled to the main body. Furthermore, the main body includes one or more cable clips each configured to retain one or more cables within the main body.