发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH WIRE-IN-FILM ENCAPSULANT AND METHOD FOR MANUFACTURING THEREOF
- 专利标题（中）： 集成电路封装系统及其制造方法及其制造方法
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申请号： US13081011申请日： 2011-04-06
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公开(公告)号： US20110180914A1公开(公告)日： 2011-07-28
- 发明人: Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
- 申请人： Byung Tai Do , Seng Guan Chow , Heap Hoe Kuan , Linda Pei Ee Chua , Rui Huang
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
A method for manufacturing a multiple encapsulation integrated circuit package-in-package system includes: dicing a top integrated circuit wafer having a bottom encapsulant thereon to form a top integrated circuit die with the bottom encapsulant; positioning internal leadfingers adjacent and connected to a bottom integrated circuit die; pressing the bottom encapsulant on to the bottom integrated circuit die; connecting the top integrated circuit die to external leadfingers adjacent the internal leadfingers; and forming a top encapsulant over the top integrated circuit die.
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