发明申请
- 专利标题: LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- 专利标题(中): 激光加工设备和激光加工方法
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申请号: US13060614申请日: 2009-08-24
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公开(公告)号: US20110181929A1公开(公告)日: 2011-07-28
- 发明人: Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito
- 申请人: Naoya Matsumoto , Takashi Inoue , Norihiro Fukuchi , Haruyasu Ito
- 申请人地址: JP SHIZUOKA
- 专利权人: HAMAMATSU PHOTONICS K.K
- 当前专利权人: HAMAMATSU PHOTONICS K.K
- 当前专利权人地址: JP SHIZUOKA
- 优先权: JP2008-216742 20080826
- 国际申请: PCT/JP2009/064725 WO 20090824
- 主分类号: G02B5/32
- IPC分类号: G02B5/32
摘要:
A laser processing device 1 includes a laser light source 10, a spatial light modulator 20, a control section 22, and a condensing optical system 30. The spatial light modulator 20 is input with a laser light output from the laser light source 10, presents a hologram for modulating the phase of the laser light in each of a plurality of two-dimensionally arrayed pixels, and outputs the phase-modulated laser light. The control section 22 causes a part of the phase-modulated laser light (incident light) to be condensed at a condensing position existing in a processing region as a laser light (contribution light) having a constant energy not less than a predetermined threshold X. On the other hand, the control section 22 causes a laser light (unnecessary light) other than the contribution light condensed to the condensing position existing in the processing region to be dispersed and condensed at a condensing position existing in a non-processing region as a plurality of laser lights (non-contribution lights) having an energy less than the predetermined threshold X.
公开/授权文献
- US08867113B2 Laser processing device and laser processing method 公开/授权日:2014-10-21
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