Invention Application
US20110183472A1 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A PLATED THROUGH-HOLE
有权
制造具有后/基热延伸器和镀层通孔的半导体芯片组件的方法
- Patent Title: METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A PLATED THROUGH-HOLE
- Patent Title (中): 制造具有后/基热延伸器和镀层通孔的半导体芯片组件的方法
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Application No.: US13079044Application Date: 2011-04-04
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Publication No.: US20110183472A1Publication Date: 2011-07-28
- Inventor: Charles W.C. Lin , Chia-Chung Wang
- Applicant: Charles W.C. Lin , Chia-Chung Wang
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Main IPC: H01L21/58
- IPC: H01L21/58
Abstract:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a plated through-hole and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
- US08298868B2 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole Public/Granted day:2012-10-30
Information query
IPC分类:
