发明申请
US20110183630A1 Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Wireless-Enabled Component (WEC) Embodiments
有权
用于芯片内和芯片间通信的无线总线，包括无线组件（WEC）实施例
- 专利标题： Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Wireless-Enabled Component (WEC) Embodiments
- 专利标题（中）： 用于芯片内和芯片间通信的无线总线，包括无线组件（WEC）实施例
-
申请号： US12877706申请日： 2010-09-08
-
公开(公告)号： US20110183630A1公开(公告)日： 2011-07-28
- 发明人: Ahmadreza (Reza) ROFOUGARAN , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- 申请人： Ahmadreza (Reza) ROFOUGARAN , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- 申请人地址： US CA Irvine
- 专利权人： Broadcom Corporation
- 当前专利权人： Broadcom Corporation
- 当前专利权人地址： US CA Irvine
- 主分类号： H04B1/38
- IPC分类号： H04B1/38 ; H02J3/00 ; H04B10/00
摘要：
Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.
公开/授权文献
信息查询
