发明申请
- 专利标题: METHOD OF FABRICATING A FINFET DEVICE
- 专利标题(中): 制造FINFET器件的方法
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申请号: US12703918申请日: 2010-02-11
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公开(公告)号: US20110193141A1公开(公告)日: 2011-08-11
- 发明人: Hsien-Hsin Lin , Tsz-Mei Kwok , Chien-Chang Su
- 申请人: Hsien-Hsin Lin , Tsz-Mei Kwok , Chien-Chang Su
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L29/78
- IPC分类号: H01L29/78
摘要:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary FinFET device includes a substrate of a crystalline semiconductor material having a top surface of a first crystal plane orientation; a fin structure of the crystalline semiconductor material overlying the substrate; a gate structure over a portion of the fin structure; an epitaxy layer over another portion of the fin structure, the epitaxy layer having a surface having a second crystal plane orientation, wherein the epitaxy layer and underlying fin structure include a source and drain region, the source region being separated from the drain region by the gate structure; and a channel defined in the fin structure from the source region to the drain region, and aligned in a direction parallel to both the surface of the epitaxy layer and the top surface of the substrate.
公开/授权文献
- US08310013B2 Method of fabricating a FinFET device 公开/授权日:2012-11-13
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