发明申请
- 专利标题： 3D CMOS Image Sensors, Sensor Systems Including the Same
- 专利标题（中）： 3D CMOS图像传感器，包括它的传感器系统
-
申请号： US12984972申请日： 2011-01-05
-
公开(公告)号： US20110193940A1公开(公告)日： 2011-08-11
- 发明人: Young-soo Park , Won-joo Kim , Kyoo-chul Cho , Gi-jung Kim , Sam-jong Choi
- 申请人： Young-soo Park , Won-joo Kim , Kyoo-chul Cho , Gi-jung Kim , Sam-jong Choi
- 优先权： KR10-2010-0011183 20100205
- 主分类号： H04N13/02
- IPC分类号： H04N13/02 ; H01L27/146
摘要：
A three-dimensional (3D) CMOS image sensor (CIS) that sufficiently absorbs incident infrared-rays (IRs) and includes an infrared-ray (IR) receiving unit formed in a thin epitaxial film, thereby being easily manufactured using a conventional CIS process, a sensor system including the 3D CIS, and a method of manufacturing the 3D CIS, the 3D CIS including an IR receiving part absorbing IRs incident thereto by repetitive reflection to produce electron-hole pairs (EHPs); and an electrode part formed on the IR receiving part and collecting electrons produced by applying a predetermined voltage thereto.
公开/授权文献
- US09035309B2 3D CMOS image sensors, sensor systems including the same 公开/授权日：2015-05-19
信息查询
