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发明申请
US20110201260A1 Methods and Systems for Retaining Grinding Efficiency During Backgrinding of Through-Via Substrates 审中-公开
通过底板倒角研磨时保持磨削效率的方法和系统

  • 专利标题： Methods and Systems for Retaining Grinding Efficiency During Backgrinding of Through-Via Substrates
  • 专利标题（中）： 通过底板倒角研磨时保持磨削效率的方法和系统
  • 申请号： US12707588
    申请日： 2010-02-17
  • 公开(公告)号： US20110201260A1
    公开(公告)日： 2011-08-18
  • 发明人: Sharath Hosali
  • 申请人： Sharath Hosali
  • 专利权人： SEMATECH, INC.
  • 当前专利权人： SEMATECH, INC.
  • 主分类号： B24B1/00
  • IPC分类号： B24B1/00 ;  B24B7/00
Methods and Systems for Retaining Grinding Efficiency During Backgrinding of Through-Via Substrates
摘要：
Methods and systems for retaining grinding efficiency during a backgrinding process such as, for example, backgrinding of a through-via substrate such as an embedded through silicon via wafer. A grinding fluid may include a chemical agent that is configured to remove accumulated materials from the grinding wheel.
摘要（中）：

用于在后研磨过程中保持研磨效率的方法和系统，例如通孔基底（例如嵌入硅通过晶片）的后研磨。 研磨液可以包括被配置为从砂轮中去除积聚的材料的化学试剂。

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