发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13126569申请日: 2010-07-09
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公开(公告)号: US20110204381A1公开(公告)日: 2011-08-25
- 发明人: Masaya Okada , Makoto Kiyama , Seiji Yaegashi , Ken Nakata
- 申请人: Masaya Okada , Makoto Kiyama , Seiji Yaegashi , Ken Nakata
- 申请人地址: JP Osaka-shi JP Yokohama-shi
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.,SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.,SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- 当前专利权人地址: JP Osaka-shi JP Yokohama-shi
- 优先权: JP2009-178324 20090730
- 国际申请: PCT/JP2010/061679 WO 20100709
- 主分类号: H01L29/20
- IPC分类号: H01L29/20 ; H01L21/335
摘要:
There are provided a semiconductor device that includes a bypass protection unit against surge voltage or the like, achieves good withstand voltage characteristics and low on-resistance (low On-state voltage), has a simple structure, and is used for large-current purpose and a method for producing the semiconductor device.In the present invention, the semiconductor device includes an n+-type GaN substrate 1 having a GaN layer that is in ohmic contact with a supporting substrate, a FET having an n−-type GaN drift layer 2 in a first region R1, and an SBD having an anode electrode in a second region R2, the anode electrode being in Schottky contact with the n−-type GaN drift layer 2. The FET and the SBD are arranged in parallel. A drain electrode D of the FET and a cathode electrode C of the SBD are formed on the back of the n+-type GaN substrate 1.
公开/授权文献
- US08227810B2 Semiconductor device and method for manufacturing same 公开/授权日:2012-07-24
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