发明申请
- 专利标题： Electroless Plating System
- 专利标题（中）： 无电镀系统
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申请号： US13111859申请日： 2011-05-19
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公开(公告)号： US20110214608A1公开(公告)日： 2011-09-08
- 发明人: Igor Ivanov , Robert D. Tas , Shashank Ravindra Kulkarni , Ron Rulkens
- 申请人： Igor Ivanov , Robert D. Tas , Shashank Ravindra Kulkarni , Ron Rulkens
- 主分类号： B05C3/02
- IPC分类号： B05C3/02
摘要：
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
公开/授权文献
- US08622017B2 Electroless plating system 公开/授权日：2014-01-07
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