发明申请
- 专利标题： Method For Detaching And Removing A Semiconductor Chip From A Foil
- 专利标题（中）： 从铝箔剥离和去除半导体芯片的方法
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申请号： US13128864申请日： 2009-11-03
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公开(公告)号： US20110214819A1公开(公告)日： 2011-09-08
- 发明人: Stefan Behler
- 申请人： Stefan Behler
- 申请人地址： CH Cham
- 专利权人： ESEC AG
- 当前专利权人： ESEC AG
- 当前专利权人地址： CH Cham
- 国际申请： PCT/EP2009/064535 WO 20091103
- 主分类号： H01L21/301
- IPC分类号： H01L21/301
摘要：
The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.
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