发明申请
- 专利标题： USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER
- 专利标题（中）： 使用包括镀金属层的石墨加热装置
-
申请号： US13108983申请日： 2011-05-16
-
公开(公告)号： US20110214851A1公开(公告)日： 2011-09-08
- 发明人: Ko-Chun CHEN , Chiu-Lang LIN
- 申请人： Ko-Chun CHEN , Chiu-Lang LIN
- 申请人地址： TW Kaohsiung City
- 专利权人： WAH HONG INDUSTRIAL CORP.
- 当前专利权人： WAH HONG INDUSTRIAL CORP.
- 当前专利权人地址： TW Kaohsiung City
- 主分类号： F28F7/00
- IPC分类号： F28F7/00
摘要：
The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.