发明申请
- 专利标题： ELECTROLESS PLATING PRODUCTION OF NICKEL AND COBALT STRUCTURES
- 专利标题（中）： 镍和镍钴结构的电镀生产
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申请号： US13105460申请日： 2011-05-11
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公开(公告)号： US20110215068A1公开(公告)日： 2011-09-08
- 发明人: Flavio Pardo , Maria E. Simon , Brijesh Vyas , Chen Xu
- 申请人： Flavio Pardo , Maria E. Simon , Brijesh Vyas , Chen Xu
- 申请人地址： US NJ Murray Hill
- 专利权人： Alcatel-Lucent USA Inc.
- 当前专利权人： Alcatel-Lucent USA Inc.
- 当前专利权人地址： US NJ Murray Hill
- 主分类号： C23F1/02
- IPC分类号： C23F1/02 ; H05K13/00
摘要：
A method comprising forming a structural element 115 on a surface 620 of a layer 510 via an electroless plating of nickel or cobalt 130 onto the surface, the layer being rigidly fixed to an underlying substrate 110. The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.
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