发明申请
- 专利标题： Modular Lateral Hip Augments
- 专利标题（中）： 模块侧向髋关节增大
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申请号： US12718230申请日： 2010-03-05
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公开(公告)号： US20110218641A1公开(公告)日： 2011-09-08
- 发明人: Aaron P. Smith , Tyler D. Witt , Hugh Apthorp , Keith R. Berend , Andrew Freiberg , John Barrington , David R. Brown
- 申请人： Aaron P. Smith , Tyler D. Witt , Hugh Apthorp , Keith R. Berend , Andrew Freiberg , John Barrington , David R. Brown
- 申请人地址： US IN Warsaw
- 专利权人： Biomet Manufacturing Corp.
- 当前专利权人： Biomet Manufacturing Corp.
- 当前专利权人地址： US IN Warsaw
- 主分类号： A61F2/32
- IPC分类号： A61F2/32
摘要：
An implant for a hip can include a lateral augment adapted to be coupled to a lateral side of a femoral body implant. The lateral augment can include a body portion having a first surface, a second surface opposite the first surface, and a protrusion extending from the second surface. The protrusion can have a shape adapted to mate with a complimentary shaped recess formed in the lateral side of the femoral body implant. An aperture can be positioned in the body portion and extend through the protrusion. A fastener can be received through the aperture and adapted to be threadably secured to the lateral bore. The fastener can be configured to have a length sufficient to pass through a portion of a greater trochanter for securing the portion of the greater trochanter and the lateral augment to the femoral body implant.
公开/授权文献
- US08460393B2 Modular lateral hip augments 公开/授权日：2013-06-11
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