发明申请
US20110221068A1 INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED
有权
包含拟进行金属化的BLIND VIAS的互连结构
- 专利标题： INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED
- 专利标题（中）： 包含拟进行金属化的BLIND VIAS的互连结构
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申请号： US13031917申请日： 2011-02-22
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公开(公告)号： US20110221068A1公开(公告)日： 2011-09-15
- 发明人: Damien SAINT-PATRICE , Sébastien Bolis , Fabrice Jacquet
- 申请人： Damien SAINT-PATRICE , Sébastien Bolis , Fabrice Jacquet
- 申请人地址： FR Paris
- 专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- 当前专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- 当前专利权人地址： FR Paris
- 优先权： FR1051727 20100310
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
An interconnect structure including: at least one first substrate, whereof at least one first face is made integral with at least one face of at least one second substrate, at least one blind via passing through the first substrate and emerging at the first face of the first substrate and at a second face, opposite the first face, of the first substrate, at least one electric contact arranged against said face of the second substrate and opposite the blind via, and/or against the first face and/or against the second face of the first substrate, at least one channel putting the blind via in communication with an environment outside the interconnect structure and/or with at least one cavity formed in the interconnect structure, and extending substantially parallel to one of said faces of the first or second substrate.
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