发明申请
- 专利标题： SELEGILINE-CONTAINING ADHESIVE PREPARATION
- 专利标题（中）： 含SEIGILINE的粘合剂制剂
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申请号： US13045591申请日： 2011-03-11
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公开(公告)号： US20110223235A1公开(公告)日： 2011-09-15
- 发明人: Keigo INOSAKA , Satoshi AMEYAMA , Koji NAKAMURA , Junichi SEKIYA
- 申请人： Keigo INOSAKA , Satoshi AMEYAMA , Koji NAKAMURA , Junichi SEKIYA
- 申请人地址： JP Osaka JP Osaka
- 专利权人： NITTO DENKO CORPORATION,FUJIMOTO CO., LTD.
- 当前专利权人： NITTO DENKO CORPORATION,FUJIMOTO CO., LTD.
- 当前专利权人地址： JP Osaka JP Osaka
- 优先权： JP2010-056631 20100312
- 主分类号： A61K9/70
- IPC分类号： A61K9/70 ; A61K31/135 ; A61P25/16
摘要：
The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (−)-(R)—N,α-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and one or two or more stabilizers selected from the group consisting of 2-mercaptobenzimidazole, sodium sulfite, butylhydroxyanisole and butylhydroxytoluene.
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