发明申请
- 专利标题： INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF
- 专利标题（中）： 集成电路配套封装系统及其制造方法
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申请号： US13154308申请日： 2011-06-06
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公开(公告)号： US20110233744A1公开(公告)日： 2011-09-29
- 发明人: Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
- 申请人： Seng Guan Chow , Ming Ying , Il Kwon Shim , Roger Emigh
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60 ; H01L21/98
摘要：
A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.